About the Journal
The Journal of Semiconductor Integration (JSI) is an international, peer-reviewed journal publishing original research and scholarly contributions in semiconductor materials, devices, fabrication, integration, and advanced packaging. The journal welcomes experimental, theoretical, computational, and applied research that advances semiconductor technology and electronic systems.
Aims and Scope
JSI covers research in:
- Semiconductor Materials and Processing: Silicon, compound semiconductors, thin films, epitaxy, and fabrication.
- Semiconductor Devices: Transistors, power devices, memory, sensors, and optoelectronics.
- Advanced Integration and Packaging: Chiplets, 2.5D/3D integration, heterogeneous integration, and system-in-package technologies.
- Bonding and Interconnects: Hybrid bonding, wafer bonding, microjoining, and interface engineering.
- Electronic and Photonic Systems: Silicon photonics, integrated circuits, and emerging computing technologies.
- Reliability and Thermal Management: Heat dissipation, failure analysis, and interconnect reliability.
- Modeling and Emerging Technologies: Simulation, artificial intelligence in manufacturing, and next-generation semiconductor architectures.
Article Types
JSI accepts original research articles, review articles, short communications, technical notes, perspectives, and scholarly correspondence.
